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Neousys Rugged Intel Skylake Fanless Computer
- Intel Skylake processing
- -25°C ~ 70°C operating temperature
- 6 USB, 4 COM, and 3 GbE ports
THE BRAINS OF YOUR OPERATION
The Nuvo-5501 is a fanless computer that offers energy-efficient Skylake performance in a compact size that is perfect for a wide range of embedded solutions. This rugged system can be equipped with 35W power optimized, embedded Intel processors ranging from versatile Celerons to powerful Core i CPUs. Leveraging the H110 chipset, the Nuvo-5501 has support for up to 16GB of DDR4 memory, offering a 20% increase in performance-per-watt over the previous generation DDR3. DDR4 memory, in combination with the efficient Skylake processing architecture allows the Nuvo-5501 to offer high-performance computing that can take on any embedded application, all while keeping costs low and its footprint small.
READY FOR ANYTHING
Combining a small footprint with robust industrial chassis design, the Nuvo-5501 is able to go anywhere and handle anything. By eliminating failure-prone fans the Nuvo-5501 keeps out dust, debris, as well as other chemical and moisture ingress, dramatically increasing system lifespan. With high shock and vibration tolerances, in combination with a wide temperature range of -25°C ~ 70°C, the Nuvo-5501 can handle the harsh environments that are commonplace in industrial settings.
CONNECTIVITY IS KEY
Well-suited as an automation controller or as the heart of an advanced vision system, the Nuvo-5501 has I/O that concentrates on connectivity for a wide array of devices, both legacy and modern, with its 6 USB ports (4 of which are USB 3.0), 3 GbE ports, 4 COM ports (2 software-programmable RS-232/422/485 ports and 2 RS-232 ports), and optional 8-CH isolated DI and 8-CH isolated DO. Additionally, the Nuvo-5501 features a full-size mini-PCIe slot and M.2 B key slot for wireless connectivity via WiFi or 4G connectivity. If a display is needed the Nuvo-5501 has one DVI-D and one VGA port, accommodating up to two HD displays.
This system is compatible with our Extrovert 4G LTE technology, an integrated modem pre-certified to operate on many of the world’s most popular cellular carrier networks. Extrovert 4G LTE hardware is ideal for today's mobile, edge computing and Industrial Internet of Things applications. To take advantage of this feature, simply configure your system with Extrovert 4G LTE connectivity and then contact your carrier to activate.
|Graphics/GPU||Intel HD Graphics 510
Intel HD Graphics 530
|Memory Type||DDR4 SO-DIMM (non-ECC)|
|Memory Capacity||16 GB|
|Memory Speed||2133 MHz|
|Memory Slot Count||2.000000|
|Number of Displays Supported||2|
|Rear I/O||1 8-CH isolated DI and 8-CH isolated DO port (Available with optional platform selection.)|
|Front I/O||4 USB 3.0 ports
2 USB 2.0 ports
2 RS-232/422/485 ports
2 RS-232 ports
1 DVI-D port
1 VGA port
3 LAN ports
|Expansion Options||1 M.2 slot
1 PCIe Mini Card (full height)
|Storage Options||2.5" HDD/SSD
|LAN Controller||Intel I210IT GbE
Intel I219LM GbE
|Input Voltage||8~35 VDC|
|Power Input||3-pin Terminal Block connector|
|Power Features||Wide Input|
|Operating Temperature Range||-25 ~ 70°C|
|Operating Humidity||10% ~ 90% (non-condensing)|
|Shock Tolerance (Operating)||Operating, 50 Grms, Half-sine 11 ms Duration (w/ SSD, according to IEC60068-2-27)|
|Vibration Tolerance (Operating)||Operating, 5 Grms, 5-500 Hz, 3 Axes (w/ SSD, according to IEC60068-2-64)|
|Dimensions (WxHxD)||221 x 76.2 x 173 mm
8.70" x 3.00" x 6.81"
|Case Material||Aluminum Extrusion
|Regulatory Information||FCC 47 CFR Part 15
RoHS 2 (2011/65/EU)
RoHS 3 (2015/863/EU)
|Manufacturer's Product Page||For more information, please see this product's webpage.|