In-house engineering and industrial design have allowed us to integrate the latest and most requested industrial IoT technologies, including accelerators, PoE, and wireless communication options to ensure Karbon 700 fits seamlessly into your application.
Built To Do More
Karbon 700 reaches a new peak of rugged computing with powerful 8-core or Xeon processing and high-powered GPU.
Built For The Edge
Deployment is easy with Karbon 700, with its deeply customizable DIO, integrated CAN bus, automotive power and flexible I/O configurations via ModBay™ expansion.
Built To Last
Rugged fanless design, wide operating temperature range, and leading shock and vibration resistance, give Karbon 700 the durability for the toughest computing environments.
Karbon 700 Specifications
Core i 35W/65W & Xeon E 80W Generation: Coffee Lake S / R Cores: 2-6
Up to 64 GB
2-pin Remote switch connector
1x 2FF Mini-SIM
4x USB 3.1 Gen 1 (Type A connector)
2x COM RS-232/422/485
8-bit Isolated Digital I/O
2x Hot-swap drive bays (optional)
8x LED array (PWR, HDD, IGN, WDT, 4x USER CFG)
1x 3.5mm audio headset (mic-in, line-out) / CTIA
5-pin power input
3-pin CAN bus
3x GbE LAN (1x LAN, 2x PoE+ 802.3at ports via ModBay™ module)
3x DisplayPort 1.2 (full-size) (support for HDMI 1.4)
2x USB 3.1 Gen 1 (Type A connector)
2x ModBay™ I/O Expansion
External fan connector with speed control
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