In-house engineering and industrial design have allowed us to integrate the latest and most requested industrial IoT technologies, including accelerators, PoE, and wireless communication options to ensure Karbon 700 fits seamlessly into your application.
Karbon 700 reaches a new peak of rugged computing with powerful 8-core or Xeon processing and high-powered GPU.
Deployment is easy with Karbon 700, with its deeply customizable DIO, integrated CAN bus, automotive power and flexible I/O configurations via ModBay™ expansion.
Rugged fanless design, wide operating temperature range, and leading shock and vibration resistance, give Karbon 700 the durability for the toughest computing environments.
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| Models | K700-SE | K700-X2 |
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| Processor | Core i 35W/65W & Xeon E 80W Generation: Coffee Lake S / R Cores: 2-6 |
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| Memory | Up to 64 GB | |
| Front I/O | Power button 2-pin Remote switch connector 1x 2FF Mini-SIM 4x USB 3.1 Gen 1 (Type A connector) 2x COM RS-232/422/485 8-bit Isolated Digital I/O 2x Hot-swap drive bays (optional) 8x LED array (PWR, HDD, IGN, WDT, 4x USER CFG) 1x 3.5mm audio headset (mic-in, line-out) / CTIA |
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| Rear I/O | 5-pin power input 3-pin CAN bus 3x GbE LAN (1x LAN, 2x PoE+ 802.3at ports via ModBay™ module) 3x DisplayPort 1.2 (full-size) (support for HDMI 1.4) 2x USB 3.1 Gen 1 (Type A connector) 2x ModBay™ I/O Expansion External fan connector with speed control |
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| PCIe Expansion | - | Single PCIe x16 or dual x8 |
| View Full Specs | View Full Specs | |
