Helix 522Fanless Industrial Computer with Hot-Swap Storage
SKU: HX522The Helix 522 is a fanless industrial computer designed for demanding edge environments. This system leverages Intel Core Ultra processing to deliver reliable performance and is configured with additional dual 2.5", hot-swappable storage drives.
- Intel Core Ultra processing for enhanced AI capability
- 2x Hot-Swap 2.5" SSD Storage Bays
- 6x USB, 2x Thunderbolt 4, 4x 2.5 GbE LAN
Configure & Buy
Need More Options? Explore the Entire Helix 520 Series
Multiple GPU Options
Modbay I/O Expansion
Scalable Performance
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Overview
INTEL CORE ULTRA PERFORMANCE
The Helix 522 is powered by Intel Core Ultra processing (Core Ultra Series 2 coming soon), designed specifically for edge AI performance and scalability. The system supports up to 96 GB of DDR5 memory for efficient operation and offers storage options including 2x M.2 2280 M-Key slots (PCIe 4, SATA III) and 2x 2.5" SSD storage bays. The system is vPro-capable (depending on the CPU selected), enabling remote KVM access and firmware updates.
HOT-SWAP STORAGE FOR MAXIMUM UPTIME
The Helix 522 features dual 2.5" SSD storage bays with hot-swap capabilities. This allows for easy drive replacement for OS image changes, rapid destruction for security reasons, or maintenance without system downtime, crucial for applications requiring continuous operation. The system is UL, RoHS, FCC, and CE certified, and has been tested for Electromagnetic Compatibility (EMC) in industrial, medical, in-vehicle, rail, and maritime applications. The Helix 522 can be DIN, Wall, Vesa and even rack mounted for flexible installation wherever it's needed and has an operating temperature range of 0 to 50°C.
VERSATILE CONNECTIVITY FOR INDUSTRIAL NEEDS
In addition to the hot-swap storage available on the HX522, it also benefits from the versatile I/O options offered by the entire HX520 series. The front panel includes 4x 2.5GbE LAN, 6x USB 3.2 ports and 2x USB-C / Thunderbolt 4 ports. The side panel offers optional connectivity such as 4x COM ports (RS232/422/485), optional CAN, optional DIO, and 2x Display Ports. Certain configurations within the HX520 series can also feature 4x 2.5GbE LAN ports.
Specifications
| Hardware Line | Industrial (Fanless) |
| Cooling Type | Fanless |
| Processor Socket | Onboard (BGA) |
| Processor Generation | Intel® Core™ Ultra Processor (Series 1) [Meteor Lake] |
| Processor | Intel® Core™ Ultra 5 125HIntel® Core™ Ultra 5 135HIntel® Core™ Ultra 7 165H |
| Processor Family | Intel Core Ultra Series 1 & 2 (Meteor and Arrow Lake) |
| Processor Features | AMT SupportEmbedded LifecycleIntel vPro® |
| Processor TDP | 28 |
| LAN Controller | Intel® I226LMIntel® I226V |
| Graphics/GPU | Intel ARC Graphics |
| Memory Type | DDR5 |
| Memory Capacity | 96 |
| Memory Clock Speed | 5600 |
| Memory Channels | Dual Channel |
| Number of Displays Supported | 4 |
| Display Mounting Options | VESA Mount |
| Front I/O | 1x Power Button 1x Factory Reset Switch 1x 3.5mm Audio Jack 6x USB 3.2 Gen 2 (Type A) 2x Thunderbolt 4, USB Type C (40 Gb/s) 4x 2.5Gb LAN |
| Rear I/O | 4x COM (RS-232/422/485) Optional CAN Optional DIO 2x Display Ports |
| Onboard I/O | 1x 4 pin Terminal Block Power 1x 3ff SIM Slot (Mapped to M.2 B-Key) 6x Antenna Mounting Holes 1x Grounding Lug 1x Remote Switch 2x DisplayPort 2.1 UHBR20 2x Dual COM (RS-232, RS-485, RS-422) 1x Fan Hat Connector |
| Expansion Options | 3FF-Sim slot (Mapped to the B-Key)1 M.2 2280 M-key (PCIe Gen 4x4)1x M.2 B-Key (PCIe Gen4 x2/USB 2.0, PCIe Gen4 x1/USB3.2 Gen 1)2x 2.5" SATA Hot Swap 7.0 - 9.5mm max |
| Storage Options | 1 M.2 2280 (PCIe Gen 4.0 x4)1 M.2 2280 (PCIe x2, SATA)2.5" Hot-swap HDD/SSD |
| System Monitoring | AMT Support |
| Connectivity | 4G LTEBluetoothWi-Fi |
| Expansion Mobile Carriers | AT&TVerizon |
| Dimensions | 106mm x 177mm x 225mm |
| Weight | 3.31 |
| Case Material | Aluminum ExtrusionSteel |
| Input Voltage Minimum | 12 |
| Input Voltage Maximum | 24 |
| Input Voltage Type | DC |
| Power Input Connector | 4-pin Terminal Block |
| Regulatory Certifications | CISPR 32/35 & EN 55032/55035EN 55032EN 60601-1-2 4th ed.EN 60950-1EN 60945 Ed. 4EN 62368-1TAA ComplianceUKCAWEEE |
| Temperature (Operating Maximum) | 50 |
| Suitable Environments | DustGeneral OfficeIndustrial |
| Humidity (Non-Condensing Operating Minimum) | 5 |
| Humidity (Non-Condensing Operating Maximum) | 95 |
| Additional Features | Onboard TPM 2.0 module4G LTECAN BusDIORemote Management: Intel vProSecure BootHailo AcceleratorAI Inference Accelerator |
| Compatible Software | Red HatUbuntu |
| Included Accessories | 1x 4 pin Terminal Block Mating Connector |
| Notes | LAN Controllers: 4x I226-V (Core Ultra 5 125H/225H) 3x I226-V, 1x I226-LM (Core Ultra 7 165H/265H/135H) Certification Markings: CE, cULus, FCC, UKCA, VCCI, RCM, RoHS, WEEE Coming soon: BIS, KCC Available Countries (incl Wi-Fi/BT): Americas: United States, Canada Asia: China, Hong Kong, Japan, Oceania: Australia, New Zealand Europe: Austria, Belgium, Bulgaria, Croatia, Czech Republic, Cyprus, Denmark, Estonia, Finland, France, Germany, Greece, Hungary, Iceland, Ireland, Italy, Latvia, Lithuania, Liechtenstein, Luxembourg, Malta, Norway, The Netherlands, United Kingdom, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden Coming soon: Saudi Arabia, UAE, India, South Korea* Colocation approved countries ( Wi-Fi/BT + LTE ): USA, CA, EU, UK, AUS/NZ Available Countries (no Wi-Fi/BT): Americas: Mexico, Brazil Asia: Singapore Other countries available, please call. |
Documentation & Support
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