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Neousys Rugged Compact AMD Ryzen Computer
- AMD Ryzen™ embedded V1605B/ V1807B series quad-core 15W/ 45W CPU
- Four Gigabit PoE+ and USB 3.0 ports with screw-lock
- MIL-STD-810G Rated with -25°C to 70°C wide-temperature operation
HIGH-PERFORMANCE AMD RYZEN™ RUGGED COMPUTER
Representing the next generation of embedded rugged computing, the POC-500 series offers incredible performance in a compact form factor. With AMD Ryzen™ Embedded V1605B 15W processor for economical performance or V1807B 45W processor for high-performance, the system features up to three times the CPU performance over previous POC series and delivers 3.6 teraflops in FP16 to create an ultra-powerful and compact embedded system.
RUGGED MIL-STD-810G RATED DESIGN
The POC-500 series provides exceptional reliability with its MIL-STD-810G rated mechanical design and screw-lock design for securing data ports. Measuring 63 x 176 x 116 mm, the system withstands dust, debris, chemical, moisture, shock, and vibration and provides quiet, reliable operation in temperatures ranging from -25°C ~ 70°C.
Note that the fifteen watt POC-515 is a completely fanless unit while the forty-five watt POC-545 is a sealed system with an external cooling fan.
Small but customizable, the POC-500 takes full advantage of Neousys’ MezIO expansion, allowing for ignition sensing, four RS-232/422/485 ports, an additional 2.5” SATA HDD/SSD, four additional USB 3.0, or 8 and 16-bit isolated DIO options to match your application’s specific needs. Standard I/O features include VGA and DisplayPort, four USB 3.0, four PoE+ LAN, and twin COM ports providing RS-232/422/485 connectivity.
This system is compatible with our Extrovert 4G LTE technology, an integrated modem pre-certified to operate on many of the world’s most popular cellular carrier networks. Extrovert 4G LTE hardware is ideal for today's mobile, edge computing and Industrial Internet of Things applications. To take advantage of this feature, simply configure your system with Extrovert 4G LTE connectivity and then contact your carrier to activate.
|Processor||AMD Ryzen™ V1605BAMD Ryzen™ V1807B|
|Processor Speed||Up to 3.2 GHz (V1605B)Up to 3.8 GHz (V1807B)|
|Processor Socket||Onboard (BGA)|
|Chipset||Shared with CPU|
|Graphics/GPU||AMD Radeon™ Vega 8 Graphics
AMD Radeon™ Vega 11 Graphics
|Memory Type||DDR4 SO-DIMM (non-ECC)|
|Memory Capacity||16 GB|
|Memory Speed||2400 MHz|
|Memory Slot Count||1.000000|
|Number of Displays Supported||1
|Rear I/O||3-pin Power input (8~35 V) 3-pin Remote Power Switch 4 GbE PoE+ LAN ports 4 USB 3.0 ports 1 DisplayPort 1 VGA port|
|Front I/O||2 RS-232/422/485 COM ports 1 Mic-In, 1 Line-Out 1 Power button|
|Expansion Options||1 Full size mPCIe socket
1 Neousys MezIO Module
|Storage Options||1 M.2 2260 M-key slot (PCIe Gen3 x4) for NVMe SSD|
|LAN Controller||Intel I350-AM4|
|Input Voltage||8~35 VDC|
|Power Input||3-pin Terminal Block connector|
|Power Features||Wide Input
|Operating Temperature Range||-25 ~ 70°C|
|Operating Humidity||10% ~ 90% (non-condensing)|
|Dimensions (WxHxD)||Without Fan 64 x 176 x 116 mm 2.52" x 6.93" x 4.57" Without Fan 81 x 176 x 118 mm 3.19" x 6.93" x 4.65"|
|Port Punchouts||3 Antenna holes|
|Mounting Options||DIN-mount (included)
|Regulatory Information||FCC 47 CFR Part 15
Electromagnetic Compatibility Directive (2014/30/EU)
RoHS 2 (2011/65/EU)