(1st Gen) Karbon 700 Rugged Edge Computer [9-48 VDC Input]

SKU
K700-SE
The current version of the Karbon 700-SE can be found here.
  • Up to Intel Core i7 or Xeon processing
  • 9-48 VDC Power Input
  • -40 to 70°C Operating Temperature Range with 35W CPU
  • UL Certification Icon
  • CE Certification Icon
  • FCC Certification Icon
  • Auto Certification Icon
  • Rail Certification Icon
  • Shock and Vibration Icon
  • Download Icon
Discontinued
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+31 88 5200 700

 
Overview
 
Karbon 700 High-performance Rugged Edge Computer

HIGH-PERFORMANCE RUGGED EDGE COMPUTER

Karbon 700 is a rugged edge computer matching high-performance with functional adaptability for reliable operation in virtually any environment. Blazing fast Hexa-Core Coffee Lake processors and 9th Gen processors (coming soon) push the limit of what's possible with embedded computing.


The C246 chipset enables Xeon processing and ECC memory for rugged server capability at the edge and allows for real-time machine learning, object detection, and behavior recognition while minimizing the dependency on large-scale data centers for data processing and reducing the cost of data transmission over paid data networks.

 

RUGGED DURABILITY

We built Karbon 700 to meet MIL-STD-810G, UNECE Reg. 10 E-Mark, and EN50155 rolling stock standards* to ensure stable and reliable performance to keep your application up and running even in the most challenging environments.


Our Hardshell Fanless design, medical-grade ESD and interference protections, and solid-state components allow the system to thrive where most computers would fail and support wide input voltage of 9-48VDC and operating temperature range of -40-70°C.


*Configuration dependent.

Karbon 700 High-performance Rugged Edge Computer
 
Karbon 700 High-performance Rugged Edge Computer

FLEXIBILITY VIA CUSTOMIZATION

Karbon 700 was designed for flexible and reliable performance at the edge. Standard features include integrated CAN bus and 8-bit DIO, 6 USB 3.1 Gen 1 ports, triple Gb LAN and support for triple independent displays via DisplayPort connectors. Connectivity options include 4G LTE, AC Wi-Fi, and gigabit LAN while support for up to four separate storage drives (two high-speed NVMe drives and two optional hot-swap drives) offers ample storage capacity.


Customize the system to your exact application needs with our ModBay™ expansion technology to deploy additional gigabit LAN, PoE support, and dual mPCIe expansion with external SIM support.

 

CELLULAR CONNECTIVITY

This system is compatible with our Extrovert 4G LTE technology, an integrated modem pre-certified to operate on many of the world’s most popular cellular carrier networks. Extrovert 4G LTE hardware is ideal for today's mobile, edge computing and Industrial Internet of Things applications. To take advantage of this feature, simply configure your system with Extrovert 4G LTE connectivity and then contact your carrier to activate.

Extrovert 4G LTE Connected Computers
 

Windows Compatibility: Please note, the Intel Coffee Lake generation of processors no longer support legacy Windows operating systems, including Windows 7. Contact us for more information.

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Karbon 700 with GPU Expansion

Looking for Karbon 700 with GPU?

 
Meet The Karbon 700-X2-2 
 
Technical Specs
More Information
SKU K700-SE
Hardware Line Rugged
Cooling Type Fanless
Processor Socket LGA1151
Processor Generation Coffee Lake
Processor Cores 2
4
6
8
Chipset Intel C246
Graphics/GPU Intel UHD Graphics 610
Intel UHD Graphics 630
Memory Type DDR4 SO-DIMM (non-ECC), DDR4 SO-DIMM (ECC)
Memory Capacity 64 GB
Memory Speed 2666 MHz
Memory Slot Count 2.000000
Number of Displays Supported 3
Rear I/O 5-Pin Power Input (9 ~ 48 V)
3-pin CAN bus
3x DisplayPort connecters
2x USB 3.2 Gen 1 ports
3x GbE LAN ports (2 PoE optional)
External Fan connection
2x ModBay (4 LAN, 4 PoE, etc.)
Front I/O 4x USB 3.2 Gen 1 ports
2x RS-232/422/485 COM ports
8-bit Isolated Digital I/O
2-pin Remote Power Switch
External Mini-SIM slot
2x 2.5” Hot-Swap Drives (optional)
Audio jack (Line-In; Mic-In) *currently not functioning*
Power button
Expansion Options 1x M.2 2230 E-key
1x mPCIe (shared with mSATA)
1x M.2 2230/60/80 M-key (PCIe x2)
1x mPCIe
Storage Options 1x mSATA (shared with mPCIe)
2x SATA 2.5" Drives
1x M.2 2280 (PCIe x4)
RAID Support 0/1
LAN Controller Intel I210-IT GbE
Intel I219-LM GbE
System Monitoring AMT Support
PTT in BIOS
TPM (Optional)
Watchdog Timer
Input Voltage 9~48 VDC
Power Input 5-pin Terminal Block
Operating Temperature Range -40 ~ 70°C (w/ 35W CPU)
-40 ~ 50°C (w/ 65W CPU)
-40 ~ 40°C (w/ 80W CPU)
Operating Humidity 10% - 95% (non-condensing)
Shock Tolerance (Operating) Tested according to MIL-STD-810G, Method 516.6 for Ground Level Equipment 40g, 11ms, sawtooth, 3 pulses positive and negative per axis, 3-axis, operating
Shock Tolerance (Non-operating) Tested according to IEC 60068-2-27 50g, 11 ms, half-sine, 3 shocks in both positive and negative directions, 3 axes, 18 total shocks, non-operating 30g, 18ms, half-sine, 3 shocks in both positive and negative directions, 3 axes, 18 total shocks, non-opera
Vibration Tolerance (Operating) Tested according to MIL-STD-810G, Method 514.6, Category 4, Common Carrier over US Highways 1 hour per axis, 3 axes
Vibration Tolerance (Non-operating) Tested according to IEC 60068-2-64, Category 3, Table A.6 3 axes, except hour/axes only and increase f2 from 150 Hz to 500 Hz, non-operating
Dimensions (WxHxD) 240 x 82 x 242 mm
9.45 x 3.23 x 9.53 in
Case Type Automotive
Customizable
Expandable
Fanless
Ruggedized
Case Material Aluminum
Aluminum Extrusion
Steel
Port Punchouts 12 Antenna Holes
Mounting Options Wall-mount (with damping bracket)
Wall-mount
Regulatory Information FCC 47 CFR Part 15
CE
UL/ETL Listed configurations available
CB scheme
WEEE Directive (2002/96/EC)
ErP Directive (2009/125/EC)
RoHS 2 (2011/65/EU)
RoHS 3 (2015/863/EU)
REACH
RCM
EN 45545-2
EN 50121-3-2
EN 55032
EN 55035
EN 62368-1
IEC 60068-2-27
IEC 60068-2-64
MIL-STD-810G Test
Warranty 2 Year Limited Warranty on parts and services
Hardware Type Edge Devices and IoT Gateways
Edge Servers

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